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Charge transport in pyroprotein-based electronic yarns.

Jun Woo Jeon1, Hyun-Seok Jang, Won Taek Jung

  • 1Department of Physics, Incheon National University, Incheon 22012, Republic of Korea. kbh37@inu.ac.kr.

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This study reveals the charge transport mechanisms in silk-derived pyroprotein electronic yarns. Electrical properties are explained by variable range hopping and tunneling conduction, influenced by heat treatment temperature.

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Area of Science:

  • Materials Science
  • Condensed Matter Physics
  • Organic Electronics

Background:

  • Pyroprotein-based carbon materials from silk show promise for electronic textiles.
  • Understanding charge transport is crucial for developing pyroprotein electronic devices.
  • Electrical characteristics of pyroproteins remain largely unreported.

Purpose of the Study:

  • Investigate the temperature-dependent charge transport behavior of pyroprotein-based electronic yarns.
  • Determine the influence of heat treatment temperature (HTT) on electrical properties.
  • Characterize the charge transport mechanisms in detail.

Main Methods:

  • Preparation of pyroprotein-based electronic yarns (e-CS yarns) from commercial silks.
  • Heat treatment of samples at various temperatures (800, 1000, 1200, 1400 °C).
  • Electrical characterization via temperature-dependent current-voltage measurements (9 K to 300 K) and structural analysis (Raman, XRD, TEM).

Main Results:

  • Linear current-voltage properties observed at low bias (100 nA).
  • Resistivity follows a crossover between 3D Mott variable range hopping and fluctuation-induced tunneling conduction.
  • Crossover temperature (Tc) is sensitive to HTT, indicating structural modulation.

Conclusions:

  • The charge transport in e-CS yarns is governed by a combination of hopping and tunneling mechanisms.
  • Heat treatment temperature critically influences the material's structure and electrical transport properties.
  • This research provides fundamental insights into the electrical behavior of pyroprotein materials for electronic applications.