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Charge transport in pyroprotein-based electronic yarns
Jun Woo Jeon1, Hyun-Seok Jang, Won Taek Jung
1Department of Physics, Incheon National University, Incheon 22012, Republic of Korea. kbh37@inu.ac.kr.
Physical Chemistry Chemical Physics : PCCP
|November 18, 2020
Summary
This study reveals the charge transport mechanisms in silk-derived pyroprotein electronic yarns. Electrical properties are explained by variable range hopping and tunneling conduction, influenced by heat treatment temperature.
Area of Science:
- Materials Science
- Condensed Matter Physics
- Organic Electronics
Background:
- Pyroprotein-based carbon materials from silk show promise for electronic textiles.
- Understanding charge transport is crucial for developing pyroprotein electronic devices.
- Electrical characteristics of pyroproteins remain largely unreported.
Purpose of the Study:
- Investigate the temperature-dependent charge transport behavior of pyroprotein-based electronic yarns.
- Determine the influence of heat treatment temperature (HTT) on electrical properties.
- Characterize the charge transport mechanisms in detail.
Main Methods:
- Preparation of pyroprotein-based electronic yarns (e-CS yarns) from commercial silks.
- Heat treatment of samples at various temperatures (800, 1000, 1200, 1400 °C).
- Electrical characterization via temperature-dependent current-voltage measurements (9 K to 300 K) and structural analysis (Raman, XRD, TEM).
Main Results:
- Linear current-voltage properties observed at low bias (100 nA).
- Resistivity follows a crossover between 3D Mott variable range hopping and fluctuation-induced tunneling conduction.
- Crossover temperature (Tc) is sensitive to HTT, indicating structural modulation.
Conclusions:
- The charge transport in e-CS yarns is governed by a combination of hopping and tunneling mechanisms.
- Heat treatment temperature critically influences the material's structure and electrical transport properties.
- This research provides fundamental insights into the electrical behavior of pyroprotein materials for electronic applications.
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