Could sonic delivery of bulk-fill resins improve the bond strength and cure depth in extended size class I cavities?

The implementation of restorative procedures that guarantee success and optimize clinical time is the target of investigations in Restorative Dentistry. This study aimed to analyze the influence of sonic insertion of bulk-fill (BF) and conventional (C) resin composites on the microtensile bond-strength (µ-TBS) and cure depth (CD) of large and deep class I restorations.

Fifty-six healthy human premolars were selected and occlusal cavities (4 x 4 x 3 mm; factor C = 5) were prepared. TC - Tetric N-Ceram (BF), SF - SonicFill (BF), and Z350 - Filtek Z350 XT (C) composite resins were used to restore the cavities, using sonic (S) and non-sonic (NS) insertion techniques. A group restored with conventional incremental insertion (I) using Z350 XT resin was performed serving as a control. Teeth were prepared for microtensile bond-strength test (µ-TBS). And also, restoration depths of 1 and 4 mm were measured with an automatic microhardness indenter (50 g -15 s) to determine the CD. Results were evaluated using ANOVA, Scheffe, and Games-Howel posthoc test (α = 0.05).

Types of resins and insertion techniques present statistical differences for µ-TBS and CD (p ≤ 0.001). The µ-TBS was higher respectively for the groups SF > TC > Z350; however, the sonic insertion for SF and Z350 (I) did not present significant differences in µ-TBS. Higher microhardness values were observed on the surface (1mm). At a depth of 4 mm Z350 (I)> SF(S)> SF(NS)> TC(S/NS)> Z350(S/NS) (p< 0.001). Pearson's Correlation of bond strength and base micro-hardness was significant (p ≤ 0.001), strong, and positive (0.955).

The influence of sonic insertion is material dependent, influenced only the microhardness of the SonicFill resin and did not interfere with the bond strength and cure depth of other bulk fill and conventional resin composite. Key words:Composite resins, dentin, hardness tests, tensile strength, Bulk-fill resins, sonic insertion.