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Emerging Light-Emitting Materials for Photonic Integration.

De-Sheng Liu¹, Jiang Wu¹, Hongxing Xu²

¹Institute of Fundamental and Frontier Sciences, University of Electronic Science and Technology of China, Chengdu, 610054, China.

Advanced Materials (Deerfield Beach, Fla.)

|December 11, 2020

Summary

This summary is machine-generated.

Emerging 2D materials and metal halide perovskites show promise for on-chip light emitters, addressing limitations in current germanium-on-silicon and III-V-on-silicon lasers for optical interconnects.

Keywords:

2D materials light-emitting diodes metal halide perovskites nano/micro lasers photonic integration

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Area of Science:

Materials Science
Optoelectronics
Photonics

Background:

The information explosion necessitates high-data-rate optical interconnections.
Efficient light sources remain a bottleneck for on-chip optical interconnects, despite progress in germanium-on-silicon (Ge-on-Si) and III-V-on-silicon (III-V-on-Si) lasers.
Emerging materials like 2D materials and metal halide perovskites offer potential solutions.

Purpose of the Study:

To review recent advancements in light-emitting materials for photonic integration.
To focus on the progress of 2D materials and metal halide perovskites as on-chip light emitters.
To discuss challenges and future perspectives for these novel materials.

Main Methods:

Review of current literature on Ge-on-Si and III-V-on-Si lasers.
Analysis of optical properties and preparation methods for 2D materials and metal halide perovskites.
Discussion of light sources based on these emerging materials.

Main Results:

2D materials and metal halide perovskites exhibit distinct advantages for on-chip light emission.
Significant progress has been made in understanding and preparing these materials for photonic integration.
These materials present a viable alternative to existing laser technologies for optical interconnects.

Conclusions:

2D materials and metal halide perovskites are promising candidates for efficient on-chip light sources.
Further research is needed to overcome current challenges and fully realize their potential in photonic integration.
These materials are key to advancing optical interconnection technologies in the information era.