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Published on: June 7, 2018
Absence of a Crystal Direction Regime in which Sputtering Corresponds to Amorphous Material
K Schlueter1, K Nordlund2, G Hobler3
1Max-Planck-Institut für Plasmaphysik, Boltzmannstrasse 2, D-85748 Garching, Germany and Fakultät für Maschinenwesen, Technische Universität München, D-85748 Garching, Germany.
Energetic ion sputtering yield in metals varies with crystal direction, differing from amorphous materials. This is due to linear collision sequences, not channeling, impacting material erosion.
Area of Science:
- Materials Science
- Surface Science
- Ion Beam Interactions
Background:
- Sputtering, the erosion of material by energetic ions, is a critical process in various industrial and research applications.
- Understanding sputter yield is essential for controlling material removal and surface modification.
Purpose of the Study:
- To investigate the relationship between crystal orientation and sputter yield in metals using energetic ions.
- To compare the sputtering behavior of polycrystalline metals with amorphous materials.
Main Methods:
- Conducting independent experiments and simulations to determine sputter yields for individual grains.
- Analyzing sputter yield as a function of crystallographic direction for heavy keV ions on metallic targets.
Main Results:
- Demonstrated that sputter yield for heavy keV ions on metals is a continuous function of crystal direction.
- Showed that polycrystalline metals with random grain orientations do not exhibit the same sputter yield as amorphous materials.
- Attributed the observed differences to linear collision sequences rather than channeling effects.
Conclusions:
- Crystal direction significantly influences sputter yield in metals under energetic ion bombardment.
- The microstructural arrangement (polycrystalline vs. amorphous) affects sputtering behavior.
- Linear collision sequences are the primary mechanism governing directional sputtering in this context.
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