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Updated: Nov 23, 2025

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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
Published on: March 20, 2015
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Back-side-on-BOX heterogeneously integrated III-V-on-silicon O-band discrete-mode lasers
Optics Express
|December 31, 2020
Abstract:
We demonstrate foundry-fabricated O-band III-V-on-silicon discrete-mode lasers. The laser fabrication follows the back-side-on-buried-oxide laser integration process and is compatible with complex, multilayer, silicon-on-insulator based platforms. A series of devices were characterized, with the best devices producing on-chip powers of nearly 20 mW with Lorentzian linewidths below 20 kHz and a side mode suppression ratio of at least 60 dB.
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