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Cryogenic C-band wavelength division multiplexing system using an AIM Photonics Foundry process design kit
Optics Express
|December 31, 2020
Summary
Silicon photonics integrated circuits enable higher data rates for superconducting computing at cryogenic temperatures. This reduces cooling power costs by minimizing heat dissipation and electrical resistance.
Area of Science:
- Superconducting computing
- Cryogenic environments
- Silicon photonics
Background:
- Cryogenic environments are essential for superconducting computing, reducing noise and resistance.
- High data rates in these systems increase cooling power demands due to heat dissipation and electrical transmission.
- Integrating silicon photonics with electronics offers a solution for higher data rates and lower power consumption.
Purpose of the Study:
- To develop and demonstrate a photonic integrated circuit (PIC) for high-speed data transmission in cryogenic environments.
- To assess the performance of silicon photonics modulators at cryogenic temperatures.
- To explore the potential for increased aggregate data rates through wavelength division multiplexing.
Main Methods:
- Fabrication of a 4-channel wavelength division multiplexing PIC using AIM Photonics PDK.
- Testing modulator performance at room temperature and 40 K.
- Demonstrating 2-channel operation at 20 Gbps aggregate data rate at 40 K.
Main Results:
- The 4-channel PIC demonstrated operation at 25 Gbps at room temperature.
- Modulators achieved 10 Gbps at 40 K.
- 2-channel operation at 40 K yielded an aggregate data rate of 20 Gbps.
Conclusions:
- Silicon photonics integration is a viable strategy for high-data-rate, low-power cryogenic computing.
- The demonstrated PIC shows potential for further scaling to higher aggregate bit rates.
- This technology can significantly reduce the cooling power costs associated with superconducting systems.

