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A Thermopile Device with Sub-Wavelength Hole Arrays by CMOS-MEMS Technology.
Chi-Feng Chen1, Chih-Hsiung Shen2, Yun-Ying Yeh1
1Department of Mechanical Engineering, National Central University, Taoyuan City 32001, Taiwan.
Sensors (Basel, Switzerland)
|January 1, 2021
Summary
This study enhances thermopile devices using sub-wavelength hole arrays (SHAs) for improved infrared absorbance (IRA). Optimized SHA structures significantly boost infrared absorption efficiencies (IAEs), crucial for advanced thermal sensing applications.
Area of Science:
- Optoelectronics
- Nanotechnology
- Materials Science
Background:
- Thermopile devices are crucial for thermal sensing.
- Enhancing infrared absorbance (IRA) is key to improving thermopile performance.
- Sub-wavelength hole arrays (SHAs) offer potential for enhanced optical properties.
Purpose of the Study:
- To numerically and experimentally investigate the IRA of thermopile devices incorporating SHAs.
- To analyze the impact of SHA geometry on IRA.
- To optimize SHA structures for maximum infrared absorption efficiency (IAE).
Main Methods:
- Finite-difference time-domain (FDTD) method for numerical simulation.
- Fabrication of prototypes using 0.35 μm CMOS-MEMS process.
- Experimental validation of simulation results.
Main Results:
- SHA structures significantly enhance IRA in thermopile devices.
- Hexagonal SHA arrangements outperform square arrangements.
- Asymmetric and elliptical SHAs show higher IAEs than symmetric ones.
- Optimized SHAs achieved up to 3.57 times higher IAEs at 60 °C.
Conclusions:
- SHAs are effective in enhancing IRA for thermopile devices.
- Structural optimization of SHAs is essential for maximizing performance.
- This research provides a pathway for developing more sensitive thermal sensing devices.
