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Updated: Nov 23, 2025

Using Micro-Electro-Mechanical Systems MEMS to Develop Diagnostic Tools

Using Micro-Electro-Mechanical Systems MEMS to Develop Diagnostic Tools

Published on: October 1, 2007

Built-In Self-Test (BIST) Methods for MEMS: A Review.

Gergely Hantos¹, David Flynn¹, Marc P Y Desmulliez¹

¹Smart Systems Group, Earl Mountbatten Building, Research Institute of Sensors, Signals and Systems, School of Engineering & Physical Sciences, Heriot-Watt University, Edinburgh EH14 4AS, UK.

|January 5, 2021

Summary

This study introduces a new classification for built-in self-test (BIST) methods for micro-electro-mechanical systems (MEMS). It benchmarks these techniques to reduce costly MEMS testing and enable in-system diagnostics.

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Area of Science:

Electrical Engineering
Materials Science
Computer Engineering

Background:

Micro-electro-mechanical systems (MEMS) testing constitutes a significant portion (50%) of end-product costs.
There is a critical need for cost-effective, non-intrusive Built-In Self-Test (BIST) solutions for MEMS.
BIST methods that can operate during system operation are highly desirable for continuous monitoring and reliability.

Purpose of the Study:

To present a novel taxonomy for classifying Built-In Self-Test (BIST) methods specifically designed for Micro-Electro-Mechanical Systems (MEMS).
To provide a comprehensive benchmark of existing BIST methods based on key performance metrics.
To identify promising avenues for future BIST and Built-In Self-Repair (BISR) development in MEMS.

Main Methods:

Keywords:

built-in-self-test (BIST)failure modes micro-electro-mechanical systems (MEMS) test multi-functional sensors

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Extensive review and analysis of various existing MEMS testing methodologies.
Development of a novel taxonomy to categorize BIST approaches.
Creation of a performance benchmarking table comparing methods across defined metrics.

Main Results:

A structured classification of BIST methods for MEMS is established.
A performance table evaluates BIST methods on ease of implementation, usefulness, test duration, and power consumption.
The table also specifies the applicable domains for each method, including field, power-on, and assembly tests.

Conclusions:

The inherent multi-modal sensing capabilities of MEMS sensors present significant opportunities for effective BIST and Built-In Self-Repair (BISR).
BIST methods are application-dependent, highlighting the need for tailored solutions.
The proposed taxonomy and benchmark provide a valuable framework for selecting and developing optimal MEMS testing strategies.