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Characterization of Thermal Transport in One-dimensional Solid Materials
Published on: January 26, 2014
Yuan Cheng1, Xing Wu, Zijian Zhang
1Institute of High Performance Computing, A*STAR, Singapore 138632, Singapore. chengy@ihpc.a-star.edu.sg zhangg@ihpc.a-star.edu.sg.
This review explores the thermal and mechanical properties of two-dimensional (2D) materials. It details their thermo-mechanical correlation, crucial for advanced nanoscale devices.
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