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Updated: Nov 20, 2025

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
Isothermal Kinetics of Epoxyphosphazene Cure
Natalia V Bornosuz1, Irina Yu Gorbunova1, Viktoria V Petrakova1
1Faculty of Petrochemistry and Polymer Materials, Mendeleev University of Chemical Technology of Russia, Miusskaya sq. 9, 125047 Moscow, Russia.
Epoxycyclophosphazene modifiers enhance epoxy-amine curing completeness compared to traditional agents. The curing process, analyzed by differential scanning calorimetry (DSC), shows distinct stages and a diffusion-controlled mechanism at the end.
Area of Science:
- Polymer Chemistry
- Materials Science
- Chemical Engineering
Background:
- Epoxy-amine systems are widely used thermosetting polymers.
- Optimizing curing kinetics and final properties is crucial for performance.
- Epoxycyclophosphazene modifiers offer potential for improved material characteristics.
Purpose of the Study:
- To investigate the effect of an epoxycyclophosphazene modifier on epoxy-amine curing.
- To compare the curing efficiency with a conventional low molecular-weight polyamide agent.
- To elucidate the curing kinetics and mechanisms involved.
Main Methods:
- Differential Scanning Calorimetry (DSC) for thermal analysis.
- Isothermal curing kinetics study.
- Model fitting and isoconversional analysis (Friedman method).
Main Results:
- Epoxycyclophosphazene modified formulations exhibited more complete curing than those with L-20.
- Curing kinetics followed an n-order approximation, with a 2-order equation fitting well for most conversions.
- Three distinct curing zones were identified, with the transition to the third zone correlating with gelation.
- Friedman method analysis indicated a diffusion-controlled mechanism during the final curing stage.
Conclusions:
- Epoxycyclophosphazene modifiers significantly improve the completeness of epoxy-amine curing.
- The curing process is complex, involving distinct kinetic stages and a transition to diffusion control.
- Understanding these mechanisms allows for tailored material design and processing optimization.
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