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Optimization of the composition in a composite material for microelectronics application using the Ising model.

Yoshihiko Imanaka1, Toshihisa Anazawa2, Fumiaki Kumasaka3

  • 1Fujitsu Laboratories Ltd., 10-1 Morinosato-Wakamiya, Atsugi, Kanagawa, 2430197, Japan. imanaka@jp.fujitsu.com.

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Summary
This summary is machine-generated.

This study introduces a novel materials informatics approach using the Ising model to optimize composite materials for heat sinks. The method efficiently identifies compositions with high thermal conductivity, suitable thermal expansion, and low weight, overcoming traditional trial-and-error limitations.

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Area of Science:

  • Materials Science
  • Computational Materials Science
  • Materials Informatics

Background:

  • Tailored material properties are crucial for industrial components, but traditional development methods are inefficient.
  • Materials informatics offers a promising solution to accelerate materials discovery and optimization.
  • Developing advanced heat sinks requires balancing thermal dissipation, substrate adhesion, and weight.

Purpose of the Study:

  • To develop a novel materials informatics approach for optimizing composite materials.
  • To design a heat sink with high thermal dissipation, silicon (Si) attachability, and low weight.
  • To apply the Ising model for solving discrete combinatorial optimization problems in materials design.

Main Methods:

  • Formulated an energy function incorporating thermal conductivity, thermal expansion, and specific gravity.
  • Utilized a quadratic unconstrained binary optimization (QUBO) formulation equivalent to the Ising model.
  • Employed a simulated annealing algorithm to solve the optimization problem.
  • Verified composite properties using the empirical mixture rule.

Main Results:

  • An optimized composite composition was identified for heat sink applications.
  • The selected composition exhibits high thermal conductivity.
  • The material demonstrates thermal expansion closely matching that of silicon (Si) and possesses low specific gravity.

Conclusions:

  • The proposed materials informatics approach effectively optimizes composite materials for specific industrial applications.
  • The Ising model and simulated annealing provide an efficient method for solving complex materials design problems.
  • This work offers a pathway to developing high-performance, lightweight heat sinks crucial for advanced electronics.