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Updated: Nov 15, 2025

Quantification of Hydrogen Concentrations in Surface and Interface Layers and Bulk Materials through Depth Profiling with Nuclear Reaction Analysis
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Ultrahigh vacuum packaging and surface cleaning for quantum devices.

M Mergenthaler1, S Paredes1, P Müller1

  • 1IBM Quantum, IBM Research Europe-Zurich, Säumerstrasse 4, 8803 Rüschlikon, Switzerland.

The Review of Scientific Instruments
|March 2, 2021
PubMed
Summary
This summary is machine-generated.

This study presents an ultra-high vacuum (UHV) package for sensitive quantum devices. The UHV system enables surface treatments and maintains vacuum for improved qubit performance.

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Area of Science:

  • Quantum computing hardware
  • Surface science for quantum devices
  • Cryogenic engineering

Background:

  • Superconducting qubits and other quantum devices are highly sensitive to surface conditions.
  • Maintaining pristine surfaces is crucial for achieving high performance and coherence times.
  • Current methods for surface treatment and vacuum handling can be complex and introduce contamination.

Purpose of the Study:

  • To design and implement an ultra-high vacuum (UHV) package for surface-sensitive quantum devices.
  • To enable in-situ surface treatments like annealing, UV irradiation, ion milling, and passivation.
  • To maintain vacuum integrity during transfer to cryogenic temperatures for device protection.

Main Methods:

  • Development of a novel UHV package with integrated active pumping (titanium getter).
  • Incorporation of a UHV loading procedure for device treatment before packaging.
  • Utilizing a bottom-loading dilution refrigerator for cryogenic measurements.
  • Characterization of the system's treatment capabilities and qubit performance.

Main Results:

  • Demonstrated capabilities for annealing, UV irradiation, ion milling, and surface passivation within the UHV package.
  • Successful maintenance of vacuum during transfer to cryogenic temperatures.
  • Flux-tunable qubits fabricated using this method achieved an average T1 = 84 µs and T2 echo = 134 µs.

Conclusions:

  • The UHV package provides a robust solution for preparing and protecting surface-sensitive quantum devices.
  • In-situ surface treatments within the UHV system significantly improve qubit coherence times.
  • This approach is promising for advancing the performance and reliability of superconducting quantum processors.