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Updated: Nov 15, 2025

Multiscale Sampling of a Heterogeneous Water/Metal Catalyst Interface using Density Functional Theory and Force-Field Molecular Dynamics
Published on: April 12, 2019
Impact of Surface Hydrophilicity on Electrochemical Water Splitting
Byung Keun Kim1, Myung Jun Kim2, Jae Jeong Kim1
1School of Chemical and Biological Engineering, Institute of Chemical Processes, Seoul National University, Gwanak 1, Gwanak-ro, Gwanak-gu, Seoul 08826, Republic of Korea.
Abstract:
The activity of electrocatalysts can be improved by modifying their electronic structures and surface morphologies. In electrochemical reactions with gas evolution, the performance of an electrocatalyst is also affected by how easily gas bubbles depart from an electrocatalyst surface. However, it is difficult to quantitatively estimate the improvement in the performance that can be achieved by promoting the departure of gas bubbles from the electrocatalyst surface. This study investigated the effect of surface hydrophilicity on the hydrogen evolution reaction (HER). The water contact angles of the nickel phosphorous (NiP) films were controlled from 40.3 to 77.2° with imperceptible differences in their intrinsic electronic structures and surface areas. Electrochemical analyses and in situ visualization of the gas evolution on the NiP films indicated that an increase in the hydrophilicity of the electrocatalysts reduced the size of gas bubbles formed on the NiP films and shortened the duration of the bubbles' stay on the NiP surface. A faster gas departure enabled continuous participation of the electrocatalyst surface in hydrogen evolution, leading to a stable electrochemical behavior of the electrocatalyst and a decrease in the overpotential at a given current density. A full-cell test revealed that the enhancement of hydrogen bubble departure on a hydrophilic NiP surface with a contact angle of 40.3° reduced the overpotential by 134 mV at a current density of 100 mA/cm2 compared to a more hydrophobic film with a contact angle of 77.2°.
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