Numerical homogenization of thermal conductivity of particle-filled thermal interface material by fast Fourier

Xiaoxin Lu1, Xueqiong Fu2, Jibao Lu1,2

  • 1Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518103, People's Republic of China.

Nanotechnology
|March 2, 2021
PubMed