Theoretical Study on the Adhesion Interaction between Epoxy Resin Including Curing Agent and Plated Gold Surface

Area of Science:

• Materials Science
• Surface Chemistry
• Computational Chemistry

Background:

• Gold and epoxy resins are vital in electronic device fabrication.
• Electrolytic gold plating for microelectronics may leave cyano groups on surfaces.
• Understanding cyano group impact on gold-epoxy adhesion is crucial for device reliability.

Purpose of the Study:

• To investigate the bonding mechanism between epoxy resin and realistic gold surfaces.
• To establish design guidelines for enhanced adhesion in electronic components.
• To minimize bonding failures in microelectronic devices.

Main Methods:

• Theoretical investigation using first-principles density functional theory (DFT).
• Construction of gold surfaces with varying cyano group coverages.
• Analysis of adhesion strength based on surface composition and bonding interactions.

Main Results:

• Increased cyano groups hinder direct gold-epoxy interaction but promote hydrogen bonding.
• Intermediate cyano coverage (approx. 33%) results in the strongest adhesion.
• Hydrogen bonds form between epoxy resin/hardener groups and surface cyano groups.

Conclusions:

• Surface cyano group coverage significantly influences gold-epoxy adhesion.
• Optimal adhesion is achieved at intermediate cyano coverage, balancing direct and hydrogen bonding.
• Findings provide guidelines for designing more robust electronic devices with improved adhesion.