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Reliability Evaluation of Fan-Out Type 3D Packaging-On-Packaging.
Pao-Hsiung Wang1, Yu-Wei Huang1, Kuo-Ning Chiang1
1Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu 300, Taiwan.
Micromachines
|April 3, 2021
Summary
This study introduces a novel fan-out wafer-level packaging (FO-WLP) using a glass substrate for packaging-on-packaging (PoP) applications. Results show glass substrate
Area of Science:
- Materials Science and Engineering
- Semiconductor Packaging Technology
- Reliability Engineering
Background:
- Fan-out wafer-level packaging (FO-WLP) is crucial for fine-pitch, high-pin-count semiconductor applications.
- Packaging-on-packaging (PoP) architecture is adopted to reduce footprint and enhance system performance.
- Glass offers excellent properties for high-speed signal transmission, making it a candidate for advanced packaging.
Purpose of the Study:
- To propose and evaluate a novel fan-out wafer-level packaging (FO-WLP) structure utilizing a glass substrate for PoP applications.
- To assess the reliability life of the proposed glass substrate-type PoP under thermal cycling conditions.
- To optimize the FO-WLP structure by investigating the impact of various design parameters on reliability.
Main Methods:
- Development and validation of 2D and 3D finite element models (FEM) based on mechanical theories.
- Simulation of thermal cycling conditions to evaluate reliability life and Mean Time To Failure (MTTF).
- Parametric studies simulating various design parameters to optimize the FO-WLP structure.
Main Results:
- Finite element models (2D and 3D) were developed and verified to yield consistent MTTF predictions.
- The coefficient of thermal expansion (CTE) of the glass substrate was identified as the most influential parameter on reliability under thermal cycling.
- Upper and lower pad thicknesses, along with buffer layer thickness, significantly impact the reliability of both FO-WLP and FO-WLP-type PoP.
Conclusions:
- The proposed glass substrate-type fan-out wafer-level packaging (FO-WLP) demonstrates potential for advanced PoP applications.
- Optimizing material properties (CTE) and structural dimensions (pad and buffer layer thicknesses) is critical for enhancing reliability.
- This research provides valuable insights for designing reliable high-performance semiconductor packages using glass substrates.
