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Electroplating and Ablative Laser Structuring of Elastomer Composites for Stretchable Multi-Layer and Multi-Material

Simon P Stier¹, Holger Böse¹

¹Center Smart Materials and Adaptive Systems, Fraunhofer Institute for Silicate Research ISC, 97082 Würzburg, Germany.

|April 3, 2021

Summary

This study introduces automated laser manufacturing for electroplated conductive elastomers, enabling novel, compact stretchable electronics and sensors with direct solderable connections.

Keywords:

ablative laser structuring composites conductive elastomers electroplating sensors stretchable electronics wearables

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Fabrication Process of Silicone-based Dielectric Elastomer Actuators

Fabrication Process of Silicone-based Dielectric Elastomer Actuators

Published on: February 1, 2016

Area of Science:

Materials Science
Manufacturing Engineering
Electrical Engineering

Background:

Traditional methods for fabricating stretchable electronics are often manual and limited in complexity.
Developing automated processes is crucial for advancing stretchable electronics and sensors.

Purpose of the Study:

To present a novel, automated manufacturing process for stretchable electronics and sensors.
To enable the creation of multi-layer, multi-material conductive elastomer structures.
To facilitate direct integration of electronic components onto stretchable substrates.

Main Methods:

Utilizing electroplated conductive elastomers and laser-assisted manufacturing.
Employing ablative, multi-layer, and multi-material fabrication techniques.
Applying doctor blade coating and electroplating for layer deposition, followed by selective laser removal (CO2 or fiber laser).

Main Results:

Demonstrated a largely automated, computer-aided manufacturing (CAM) process.
Achieved multi-layer structures with fine through-plating for compact designs.
Enabled direct soldering of electronic components onto metallized areas of stretchable circuits.
Successfully manufactured a thin, solderable pressure sensor using silicone foam dielectric and stretchable circuit board.

Conclusions:

The developed process significantly enhances the fabrication of stretchable electronics and sensors.
It allows for more complex and compact designs than previously possible.
The direct solderability bridges the gap between conventional and stretchable electronics, opening new application possibilities.