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Full-field Strain Measurements for Microstructurally Small Fatigue Crack Propagation Using Digital Image Correlation Method
Published on: January 16, 2019
Damage Evolution and Fracture Behavior of C/SiC Minicomposites with Different Interphases under Uniaxial Tensile Load
Zhongwei Zhang1, Longbiao Li2, Zhaoke Chen3
1Institute of Advanced Structure Technology, Beijing Institute of Technology, Beijing 100081, China.
Abstract:
In this paper, the tensile damage and fracture behavior of carbon fiber reinforced silicon carbide (C/SiC) minicomposites with single- and multiple-layer interphases are investigated. The effect of the interphase on the tensile damage and fracture behavior of C/SiC minicomposites is analyzed. The evolution of matrix cracking under the tensile load of the C/SiC minicomposite with a notch is observed using the digital image correlation (DIC) method. The damage evolution process of the C/SiC minicomposite can be divided into four main stages, namely, (1) an elastic response coupled with partial re-opening of thermal microcracking; (2) multiple matrix microcracking perpendicular to the applied loading; (3) crack opening and related fiber/matrix, bundle/matrix, and inter-bundle debonding; and (4) progressive transfer of the load to the fibers and gradual fiber failure until composite failure/fracture. On the fracture surface, a large number of fibers pulling out of the samples with both single-layer and multi-layer interphases can be clearly observed.
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