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Strain-Reduced Micro-LEDs Grown Directly Using Partitioned Growth.

Shunpeng Lu1, Yiping Zhang1, Zi-Hui Zhang1,2

  • 1LUMINOUS! Center of Excellence for Semiconductor Lighting and Displays, The Photonics Institute, School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, Singapore.

Frontiers in Chemistry
|April 5, 2021
PubMed
Summary

Optimizing strain-reduced micro-LEDs involves careful chip size selection. Decreasing size to 100 µm improves optical properties by reducing stress, but further reduction to 50 µm induces defects and lowers efficiency.

Keywords:
QCSERamanmicro-LEDpartitioned growth modelsize effectstrain release

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Area of Science:

  • Materials Science
  • Optoelectronics
  • Semiconductor Devices

Background:

  • Micro-light-emitting diodes (micro-LEDs) are crucial for advanced display technologies.
  • Strain in micro-LEDs affects optical properties and device performance.
  • Controlling strain through chip size is a key challenge in micro-LED fabrication.

Purpose of the Study:

  • To investigate the effect of chip size on the optical properties of strain-reduced micro-LEDs.
  • To understand the relationship between chip size, in-plane compressive stress, and indium concentration in quantum wells.
  • To determine optimal design rules for high-power micro-LED performance.

Main Methods:

  • Micro-LEDs of various sizes (50-1000 µm) were fabricated using partitioned growth via metal-organic chemical-vapor deposition (MOCVD).
  • Experimental characterization was employed to study optical properties and indium incorporation.
  • Analysis focused on the correlation between chip dimensions and device performance metrics.

Main Results:

  • Decreasing micro-LED chip size from 1000 µm to 100 µm improved optical properties by reducing in-plane compressive stress.
  • Further reduction to 50 µm × 50 µm resulted in decreased efficiency due to induced defects and higher indium incorporation.
  • The study identified an optimal chip size range for maximizing output power.

Conclusions:

  • Chip size significantly impacts strain, indium incorporation, and optical performance in micro-LEDs.
  • A balance must be struck between strain reduction and defect mitigation for optimal device efficiency.
  • The partitioned growth process offers a pathway to engineer strain-reduced micro-LEDs with enhanced power performance.