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Quantifying adhesive thickness and adhesion parameters using higher-order SH guided waves.

Dileep Koodalil1, Prabhu Rajagopal1, Krishnan Balasubramaniam1

  • 1Centre for Nondestructive Evaluation, Department of Mechanical Engineering, Indian Institute of Technology Madras, Chennai 600036, India.

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Summary

This study presents a new method for nondestructive evaluation of adhesive bonds using guided waves to quantify epoxy thickness, interface shear stiffness, and shear modulus in aluminum joints, reducing false alarms.

Keywords:
Adhesive bondsBond stiffnessInterface weaknessPPM-EMATsSH-guided wavesViscoelastic damping

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Area of Science:

  • Materials Science
  • Non-destructive Testing
  • Acoustic Wave Propagation

Background:

  • Assessing adhesive bond quality in layered materials like aluminum-epoxy-aluminum joints is crucial for structural integrity.
  • Traditional methods may suffer from limitations in accurately quantifying interfacial properties and can lead to false alarms.

Purpose of the Study:

  • To develop and validate a quantitative method for determining interface shear stiffness, adhesive shear modulus, and adhesive thickness in aluminum-epoxy-aluminum joints.
  • To utilize shear horizontal (SH)-like guided waves for sensitive characterization of adhesive bond properties.
  • To minimize false alarms in non-destructive evaluation (NDE) of adhesive bonds.

Main Methods:

  • A numerical model with spring stiffness boundary conditions was developed to generate dispersion curves for SH-like modes.
  • Analysis of mode sensitivity to epoxy thickness, interface shear stiffness, and adhesive shear modulus.
  • Generation and detection of SH-like modes using periodic permanent magnet (PPM) electromagnetic acoustic transducers (EMATs).
  • Separation of merged modes using Short-Time Fourier Transform (STFT).
  • Quantification of epoxy thickness using SH2-like mode dispersion curves and STFT.
  • Measurement of interface shear stiffness and epoxy shear modulus using SH3-like mode dispersion curves, measured thickness, and STFT.

Main Results:

  • Higher-order anti-symmetric SH-like modes were found to be sensitive to epoxy thickness, interface shear stiffness, and adhesive shear modulus.
  • Symmetric SH-like modes were primarily sensitive to adhesive thickness.
  • Simultaneous generation and analysis of symmetric and anti-symmetric modes were shown to prevent false alarms.
  • Experimental validation on aluminum-epoxy-aluminum samples with varying surface treatments confirmed the method's reliability.

Conclusions:

  • The proposed method offers a reliable NDE technique for characterizing adhesive bonds in layered structures.
  • Simultaneous analysis of different SH-like modes effectively distinguishes between various bond degradation mechanisms.
  • The approach significantly reduces the likelihood of false alarms in assessing adhesive bond quality.