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Biasing of Metal-Semiconductor Junctions01:27

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Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
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There is variation in the electrical conductivity of materials - metals, semiconductors, and insulators that are showcased with the help of the energy band diagrams.
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The conduction of free electrons inside a conductor is best described by quantum mechanics. However, a classical model makes predictions close to the results of quantum mechanics. It is called the theory of metallic conduction.
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The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
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Updated: Nov 8, 2025

Determination of the Excitation and Coupling Rates Between Light Emitters and Surface Plasmon Polaritons
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Cooling Metals via Gap Plasmon Resonance.

Jin-Woo Cho1, Sung-Jun Park1, Su-Jin Park1

  • 1Department of Applied Physics, Kyung Hee University, Gyeonggi-do 17104, Republic of Korea.

Nano Letters
|April 21, 2021
PubMed
Summary

Researchers developed metallic surfaces with high emissivity for radiative cooling. These surfaces effectively manage mid-infrared spectrum radiation, enabling passive cooling of surfaces and potential applications in optoelectronic devices.

Keywords:
gap plasmon resonancemetal-dielectric interfacemid-infrared photonicsradiative coolingspectrum management

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Area of Science:

  • Materials Science
  • Optics
  • Nanotechnology

Background:

  • Metals typically have high reflectivity across the thermal radiation spectrum.
  • Effective radiative cooling requires materials with high emissivity in the atmospheric transparency window (8-13 μm).

Purpose of the Study:

  • To design and fabricate metallic surfaces with high emissivity for radiative cooling.
  • To investigate the performance of these surfaces under solar heating conditions.
  • To explore their potential application in cooling optoelectronic devices.

Main Methods:

  • Fabrication of a square-lattice array of Copper/Zinc Sulfide/Copper (Cu/ZnS/Cu) gap plasmon cavities.
  • Design to avoid near-field coupling and mode anticrossing.
  • Measurement of effective emissivity up to 60° incidence.
  • Outdoor solar heating experiments comparing multicavity arrays with planar multilayers.

Main Results:

  • Achieved effective emissivity greater than 0.62 for the gap plasmon cavities.
  • Demonstrated radiative cooling, lowering substrate temperature by 4 °C under simulated sunlight.
  • Confirmed the ability to sustain multiple high-amplitude gap plasmon cavity modes within the 8-13 μm spectrum at room temperature.

Conclusions:

  • The developed Cu/ZnS/Cu multicavity structures exhibit significant mid-infrared spectrum management for radiative cooling.
  • These surfaces offer a viable approach for passive cooling of materials and devices.
  • Potential for integration into optoelectronic devices for thermal management through radiative heat dissipation.