Impact of substrate elasticity on contact angle saturation in electrowetting

The electrostatically assisted wettability enhancement of dielectric solid surfaces, commonly termed as electrowetting-on-dielectric (EWOD), facilitates many microfluidic applications due to simplicity and energy efficiency. The application of a voltage difference between a conductive droplet and an insulated electrode substrate, where the droplet sits, is enough for realizing a considerable contact angle change. The contact angle modification is fast and almost reversible; however it is limited by the well-known saturation phenomenon which sets in at sufficiently high voltages. In this work, we experimentally show and computationally support the effect of elasticity and thickness of the dielectric on the onset of contact angle saturation. We found that the effect of elasticity is important especially for dielectric thickness smaller than 10 μm and becomes negligible for thickness above 20 μm. We attribute our findings on the effect of the dielectric thickness on the electric field, as well as on the induced electric stresses distribution, in the vicinity of the three phase contact line. Electric field and electric stresses distribution are numerically computed and support our findings which are of significant importance for the design of soft materials based microfluidic devices.