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Thermal interface material with graphene enhanced sintered copper for high temperature power electronics.

Shaojia Deng1, Xin Zhang1, Guowei David Xiao2

  • 1State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment, School of Electromechanical Engineering, Guangdong University of Technology, Guangzhou 510006, People's Republic of China.

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Summary

Sintered nano-copper thermal interface materials (TIMs) show improved thermal conductivity by adding graphene/Cu-Cu₂O. This enhancement is crucial for high-power electronics and high-temperature applications.

Keywords:
graphenepower electronic packagingsintered nano-copperthermal conductivitythermal interface material

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Electronics Engineering

Background:

  • Sintered nano-copper is a promising thermal interface material (TIM) for high power electronics due to its high thermal conductivity and operating temperature.
  • Conventional TIMs face limitations in performance, cost, or electromigration resistance.
  • Existing nano-copper TIMs suffer from high porosity, limiting their thermal performance.

Purpose of the Study:

  • To enhance the thermal conductivity of sintered copper TIMs.
  • To investigate the effect of graphene/Cu-Cu₂O addition on copper particle sintering.
  • To evaluate the suitability of the developed TIM for high power electronic packaging.

Main Methods:

  • Addition of graphene/Cu-Cu₂O with a controllable diameter of approximately 163 nm to sintered copper.
  • Fabrication of sintered composite TIMs.
  • Measurement of thermal conductivity, electrical performance, and mechanical performance.

Main Results:

  • Thermal conductivity of the sintered composite TIM was enhanced by up to 123.5% compared to sintered pure copper.
  • Formation of a graphene heat transfer network within the sintered TIM.
  • Development of C-O-Cu bonds at the graphene-copper nanoparticle interface, improving overall performance.

Conclusions:

  • The addition of graphene/Cu-Cu₂O significantly improves the thermal conductivity of sintered copper TIMs.
  • The developed composite TIM offers superior thermal, electrical, and mechanical properties.
  • This advanced TIM is suitable for high-temperature applications in high power electronic packaging, such as IGBT, SiC, and GaN devices.