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A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging
1Key Laboratory for Advanced Materials Processing Technology, Ministry of Education of China, State Key Laboratory of Tribology, Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China.
Nanomaterials (Basel, Switzerland)
|April 30, 2021
Summary
Polyol-based silver nanoparticles (Ag NPs) offer a promising low-temperature bonding solution for electronic packaging. Reduced organic content in Ag NP paste enhances bondability and high-temperature joint properties, outperforming traditional solders.
Area of Science:
- Materials Science
- Nanotechnology
- Electronic Packaging
Background:
- Metal nanoparticles (NPs), particularly silver (Ag NPs), are gaining traction for advanced electronic packaging.
- Low-temperature bonding materials are crucial for next-generation electronic devices.
Purpose of the Study:
- To review research progress on polyol-based Ag NPs for electronic packaging interconnections.
- To investigate the synthesis, bonding mechanisms, and properties of Ag NP pastes.
Main Methods:
- Preparation of polyol-based Ag NP paste with controlled concentration.
- Investigation of organic component effects on bondability and coffee ring effect.
- Analysis of Ag NP sintering behavior using a sphere-to-sphere approach.
Main Results:
- Polyol-based Ag NP paste with reduced organic content improved bondability.
- Increased Marangoni flow successfully suppressed the coffee ring effect.
- Ag NP joints exhibited superior mechanical properties compared to Pb95Sn5 solders after high-temperature storage.
Conclusions:
- Polyol-based Ag NP sintering-bonding technology is effective for low-temperature electronic packaging.
- Optimized Ag NP paste formulation enhances interconnection reliability.
- This approach presents a viable alternative to traditional solders for demanding applications.
