Properties and Mechanism of PEALD-In₂O₃ Thin Films Prepared by Different Precursor Reaction Energy

Indium oxide (In₂O₃) film has excellent optical and electrical properties, which makes it useful for a multitude of applications. The preparation of In₂O₃ film via atomic layer deposition (ALD) method remains an issue as most of the available In-precursors are inactive and thermally unstable. In this work, In₂O₃ film was prepared by ALD using a remote O₂ plasma as oxidant, which provides highly reactive oxygen radicals, and hence significantly enhancing the film growth. The substrate temperature that determines the adsorption state on the substrate and reaction energy of the precursor was investigated. At low substrate temperature (100-150 °C), the ratio of chemically adsorbed precursors is low, leading to a low growth rate and amorphous structure of the films. An amorphous-to-crystalline transition was observed at 150-200 °C. An ALD window with self-limiting reaction and a reasonable film growth rate was observed in the intermediate temperature range of 225-275 °C. At high substrate temperature (300-350 °C), the film growth rate further increases due to the decomposition of the precursors. The resulting film exhibits a rough surface which consists of coarse grains and obvious grain boundaries. The growth mode and properties of the In₂O₃ films prepared by plasma-enhanced ALD can be efficiently tuned by varying the substrate temperature.