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Back Injection Molding of Sub-Micron Scale Structures on Roll-to-Roll Extrusion Coated Films.

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  • 1Laboratory for Micro- and Nanotechnology, Paul Scherrer Institute (PSI), 5232 Villigen, Switzerland.

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Summary
This summary is machine-generated.

This study demonstrates bonding flexible films to polymer parts using back injection molding (BIM). This method successfully embeds conductive silver wires into microstructured V-grooves for functionalized polymer components.

Keywords:
back injection moldingconductive nanoparticle inkprinted flexible electronicsroll-to-roll extrusion coatingthermal bonding

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Area of Science:

  • Materials Science
  • Polymer Engineering
  • Surface Science

Background:

  • Roll-to-roll extrusion coated films are crucial for flexible electronics and packaging.
  • Integrating these films onto non-flat polymer substrates presents manufacturing challenges.
  • Surface modification techniques are key to achieving robust film-substrate adhesion.

Purpose of the Study:

  • To investigate the feasibility of bonding pre-patterned polypropylene (PP) coated polyethylene terephthalate (PET) films onto polymer parts using back injection molding (BIM).
  • To explore methods for enhancing the bonding process, including thermal parameters and plasma treatment.
  • To demonstrate the integration of conductive nanoparticle ink into microstructured V-grooves for embedded circuitry.

Main Methods:

  • Utilized roll-to-roll extrusion coated PP/PET films pre-patterned with V-shaped microgrooves.
  • Employed back injection molding (BIM) to bond films onto PET and poly(methyl methacrylate) (PMMA) substrates.
  • Varied tool and melt temperatures, and applied oxygen plasma treatment to the PET film's backside.
  • Embedded conductive silver nanoparticle ink into PP coating via controlled collapse of V-grooves.

Main Results:

  • Successful bonding of PP/PET films onto PET and PMMA parts was achieved.
  • Oxygen plasma treatment significantly enhanced the adhesion between the film and the polymer part.
  • Controlled collapse of V-grooves enabled the embedding of silver wires from conductive ink.
  • Demonstrated the fabrication of functionalized non-flat polymer parts.

Conclusions:

  • Back injection molding (BIM) is a viable technique for integrating flexible films with microstructured conductive elements onto non-flat polymer substrates.
  • Oxygen plasma pre-treatment is a critical factor for enhancing bonding strength.
  • This approach offers a pathway for manufacturing polymer parts with integrated surface functionality for applications in flexible electronics and packaging.