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Integrating a Triplet-triplet Annihilation Up-conversion System to Enhance Dye-sensitized Solar Cell Response to Sub-bandgap Light
Published on: September 12, 2014
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Advanced research trends in dye-sensitized solar cells
Mikko Kokkonen1, Parisa Talebi2, Jin Zhou1
1Microelectronics Research Unit, Faculty of Information Technology & Electrical Engineering, University of Oulu P. O. Box 4500 FI-90014 Finland ghufran.hashmi@oulu.fi.
Summary
Dye-sensitized solar cells (DSSCs) offer economic indoor photovoltaics for electronics. Research advances in materials and scalable fabrication promise improved efficiency and stability for widespread adoption.
Area of Science:
- Materials Science
- Renewable Energy
- Photovoltaics
Background:
- Dye-sensitized solar cells (DSSCs) are efficient for indoor light harvesting in electronic devices.
- Their potential for low-cost, flexible solar modules is significant for economic indoor photovoltaics.
- Scaling fabrication for industrial manufacturing with high efficiency and stability is crucial.
Purpose of the Study:
- Review recent advancements in DSSC research for industrial scalability.
- Discuss improvements in DSSC components and fabrication techniques.
- Propose a scalable, monolithic cell design integrating new developments.
Main Methods:
- Review of new device structures, redox shuttles, and solid-state hole conductors.
- Analysis of TiO2 photoelectrodes, catalyst materials, and sealing techniques.
- Proposal of a monolithic cell design with inkjet/screen printing, PEDOT, CNTs, and epoxy encapsulation.
Main Results:
- Significant progress in individual DSSC components (photoelectrodes, conductors, catalysts).
- Development of scalable fabrication techniques like inkjet and screen printing.
- Integration of advancements into a novel monolithic cell architecture.
Conclusions:
- DSSC technology shows promise for economic indoor photovoltaics.
- Scalable fabrication processes and improved components are key to high efficiency and stability.
- New stability testing protocols are needed for deployment in portable electronics and IoT devices.

