An investigation of tensile strength of dental solder joints

Tensile specimens of dental solder joints were tested to determine the effect of gap distance on the strength of solder joints. Two dental alloys were used; a Type III gold alloy and a gold-palladium (Au-Pd) alloy. The Type III alloy was joined with the recommended gold solder. The Au-Pd alloy was joined using preceramic and postceramic application soldering techniques. Gap distances of 0.13 mm, 0.5 mm, and 1 mm were used with each soldering technique. All solder specimens were machined to a uniform diameter and then tested for tensile strength. It was concluded that: 1. There was a significant increase in strength for the Type III gold as the gap distance was increased. 2. The trend toward stronger joints at narrow gap distances for Au-Pd alloy joined with presolder was not statistically significant. 3. The trend toward stronger joints at wide gap distances for the Au-Pd alloy joined with the postsolder was not statistically significant. 4. The postsolder joints were statistically stronger than the presolder joints. 5. The trends observed could be partially explained in terms of competing effects of yield strength (triaxially), wettability, and void or inclusion content at the various gap distances.