Ultrasonic-assisted electrodeposition of Cu-Sn-TiO₂ nanocomposite coatings with enhanced antibacterial activity

Copper-based coatings are known for their high antibacterial activity. In this study, nanocomposite Cu-Sn-TiO₂ coatings were obtained by electrodeposition from an oxalic acid bath additionally containing 4 g/dm³ TiO₂ with mechanical and ultrasonic agitation. Ultrasound treatment was performed at 26 kHz frequency and 32 W/dm³ power. The influence of agitation mode and the current load on the inclusion and distribution of the TiO₂ phase in the Cu-Sn metallic matrix were evaluated. Results indicated that ultrasonic agitation decreases agglomeration of TiO₂ particles and allows for the deposition of dense Cu-Sn-TiO₂ nanocomposites. It is shown that nanocomposite Cu-Sn-TiO₂ coatings formed by ultrasonic-assisted electrodeposition exhibit excellent antimicrobial properties against E. coli bacteria.