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Development of Flexible and Functional Sequins Using Subtractive Technology and 3D Printing for Embroidered Wearable
Ramona Nolden1, Kerstin Zöll1, Anne Schwarz-Pfeiffer1
1Research Institute for Textile and Clothing, Hochschule Niederrhein-University of Applied Sciences, Webschulstraße 31, 41065 Mönchengladbach, Germany.
Materials (Basel, Switzerland)
|June 2, 2021
Summary
Flexible sequins serve as circuit board substrates for wearable textiles, overcoming the rigidity of traditional boards. This innovation integrates sensors and electrodes into fabrics using embroidery and 3D printing technologies.
Area of Science:
- Materials Science
- Textile Engineering
- Electrical Engineering
Background:
- Traditional rigid circuit boards limit integration into soft textiles.
- Embroidery is a key technology for connecting electronics in textiles.
- Need for flexible and soft electronic substrates in wearable technology.
Purpose of the Study:
- To develop flexible and functional sequins as circuit board substrates for wearable textile applications.
- To demonstrate the integration of these sequins with surface-mounted devices and conductive threads.
- To enable seamless integration of electronics into textiles via automated embroidery.
Main Methods:
- Utilized subtractive technology (wax printing and etching copper-clad foils).
- Employed additive technology (dual 3D printing of insulating and conductive materials).
- Developed one-sided flexible sequins and circuit boards.
Main Results:
- Successfully produced flexible and functional sequins and circuit boards.
- Integrated surface-mounted devices onto the flexible sequins.
- Demonstrated the application of sequins to textiles using automated embroidery and conductive threads.
Conclusions:
- Flexible sequins offer a viable alternative to rigid circuit boards for wearable electronics.
- The developed subtractive and additive techniques enable the creation of integrated electronic textiles.
- This approach facilitates the incorporation of sensors and electrodes into fabrics for advanced wearable applications.
