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Updated: Nov 1, 2025

Evaluation of the Curing of Adhesive Systems by Rheological and Thermal Testing
Published on: July 3, 2020
Thermoset resin curing simulation using quantum-chemical reaction path calculation and dissipative particle dynamics
Yoshiaki Kawagoe1, Gota Kikugawa2, Keiichi Shirasu1
1Department of Aerospace Engineering, Tohoku University, Sendai 980-8579, Japan. kawagoe@tohoku.ac.jp.
A new dissipative particle dynamics (DPD) simulation accurately models thermoset resin curing, significantly reducing computational cost. This method enables efficient material property evaluation and screening for advanced composites.
Area of Science:
- Materials Science
- Computational Chemistry
- Polymer Science
Background:
- Thermoset resins are crucial matrices in carbon-fiber-reinforced plastics.
- Traditional curing simulations using all-atom molecular dynamics (AA-MD) are computationally intensive.
- Efficient simulation methods are needed for optimizing material properties.
Purpose of the Study:
- To develop a computationally efficient simulation technique for thermoset resin curing.
- To accurately model the exothermic reaction process during resin curing.
- To enable precise evaluation of thermomechanical properties of cured resins.
Main Methods:
- Utilized dissipative particle dynamics (DPD) simulations for larger system and longer timescale modeling.
- Incorporated quantum-chemical calculations to determine reactivity based on reaction types.
- Developed a reverse mapping technique to reconstruct all-atom molecular dynamics (AA-MD) systems from DPD simulations.
Main Results:
- DPD curing simulations accurately represented the exothermic reaction process.
- Achieved significant reductions in run-time (1/480) and computational resources (1/10) compared to AA-MD.
- Reconstructed AA-MD systems showed good agreement with AA-MD and experimental data for X-ray diffraction and thermomechanical properties.
Conclusions:
- The proposed DPD simulation technique offers a highly efficient method for modeling thermoset resin curing.
- Enables accurate prediction of structural and thermomechanical properties at a drastically reduced computational cost.
- Facilitates high-throughput screening and large-scale system calculations for novel material development.
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