Thermoset resin curing simulation using quantum-chemical reaction path calculation and dissipative particle dynamics

Yoshiaki Kawagoe1, Gota Kikugawa2, Keiichi Shirasu1

  • 1Department of Aerospace Engineering, Tohoku University, Sendai 980-8579, Japan. kawagoe@tohoku.ac.jp.

Soft Matter
|June 25, 2021
PubMed
Summary

A new dissipative particle dynamics (DPD) simulation accurately models thermoset resin curing, significantly reducing computational cost. This method enables efficient material property evaluation and screening for advanced composites.