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Fabrication of Functionally Graded Diamond/Al Composites by Liquid-Solid Separation Technology.

Hongyu Zhou1, Yaqiang Li2, Huimin Wang1

  • 1National Center for Materials Service Safety, University of Science and Technology Beijing, Beijing 100083, China.

Materials (Basel, Switzerland)
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PubMed
Summary

This study introduces a novel liquid-solid separation technology to create graded diamond/aluminum composites for electronic packaging shells. This innovation addresses varied performance requirements, enhancing thermal stability in microelectronic components.

Keywords:
coefficient of thermal expansiondiamond/Al compositesfunctionally graded compositesinterfaceliquid–solid separationnear-net shape forming

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Area of Science:

  • Materials Science
  • Mechanical Engineering
  • Electronics Packaging

Background:

  • Traditional electronic packaging shells lack position-specific material properties required for optimal performance.
  • Mechanical processing of uniform blocks results in shells with uniform properties, failing to meet diverse functional demands.
  • Hermetic packaging of large microelectronic devices necessitates advanced materials for shells.

Purpose of the Study:

  • To develop a method for fabricating electronic packaging shells with graded material properties.
  • To address the challenge of meeting varied performance requirements at different shell locations.
  • To improve the thermal stability and reliability of microelectronic packaging components.

Main Methods:

  • Application of an independently developed liquid-solid separation technology.
  • Fabrication of diamond/aluminum (Al) composites with a gradient distribution of diamond particles.
  • Characterization of interfacial properties and material performance metrics (thermal conductivity, coefficient of thermal expansion, bending strength).

Main Results:

  • Achieved a graded distribution of diamond particles in diamond/Al composites, decreasing from 48 vol.% at the bottom to 15 vol.% at the top.
  • The bottom of the shell exhibits high thermal conductivity (169 W/mK) and lower bending strength (88 MPa), suitable for chip housing.
  • The top of the shell shows lower thermal conductivity (108 W/mK) but higher bending strength (175 MPa), ideal for cover plate welding.

Conclusions:

  • The developed liquid-solid separation technology enables near-net shape forming of packaging shells with tailored, graded properties.
  • The graded diamond/Al composites effectively meet the special requirements of different shell sections, enhancing thermal stability.
  • This approach offers a promising solution for advanced electronic packaging material fabrication.