Adhesive Bonding of Copper Prepared by Laser-Interference near the Interference Structuring Limits.

Area of Science:

• Materials Science and Engineering
• Surface Engineering
• Adhesive Bonding Technologies

Background:

• Adequate surface preparation is crucial for high-quality adhesive joints.
• Adhesive joining is increasingly applied in thermal systems, demanding robust joint performance.
• Traditional surface preparation methods like abrasion may not be optimal for advanced applications.

Purpose of the Study:

• To investigate the surface topology of copper 110 produced by laser-interference structuring.
• To evaluate the impact of laser-structured surfaces on the mechanical performance of single-lap shear joints.
• To compare laser-interference structuring with traditional abrasion for surface preparation in adhesive bonding.

Main Methods:

• Copper 110 surfaces were processed using a laser-interference setup.
• Surface characterization involved scanning electron microscopy (SEM) and profilometry.
• Single-lap shear tests were conducted on joints prepared with laser-structured and abraded surfaces.

Main Results:

• Laser-interference structuring resulted in melt-induced texturing, forming web-like structures.
• Laser-structured specimens exhibited 16.8% higher shear-lap strength compared to abraded baseline specimens.
• Laser-structured joints showed significantly increased ductility and 80-90% higher absorbed energy.

Conclusions:

• Laser-interference structuring enhances the bonding performance of copper surfaces for adhesive joints.
• The improved performance is attributed to enhanced surface topology leading to greater strength and ductility.
• This laser-based method offers a promising alternative to traditional surface preparation techniques.