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A Review on Terahertz Technologies Accelerated by Silicon Photonics
Jingya Xie1, Wangcheng Ye1, Linjie Zhou2,3
1Terahertz Technology Innovation Research Institute, Terahertz Spectrum and Imaging Technology Cooperative Innovation Center, Shanghai Key Lab of Modern Optical System, University of shanghai for Science and Technology, Shanghai 200093, China.
Silicon photonics is advancing terahertz (THz) technologies for applications like imaging and communication. This review covers progress in THz generation, modulation, and detection using silicon photonics, overcoming current challenges for integrated circuits.
Area of Science:
- Terahertz (THz) technology and silicon photonics integration.
Background:
- THz technologies, bridging infrared and microwaves, offer vast application potential in imaging, security, and wireless communications.
- Photonics, particularly photomixing, has driven THz wave generation, modulation, and detection.
- Silicon photonics presents opportunities for cost-effective, large-scale fabrication and integration of THz devices.
Purpose of the Study:
- To provide an overview of recent advancements in THz technologies utilizing silicon photonics and hybrid silicon photonics.
- To highlight progress in THz generation, detection, modulation (phase and intensity), and passive components.
- To discuss challenges and future prospects for integrated THz systems.
Main Methods:
- Review of recent research in silicon photonics for THz applications.
- Analysis of techniques for THz generation, modulation, and detection.
- Exploration of hybrid silicon approaches for THz integrated systems.
Main Results:
- Significant progress has been made in THz generation, detection, and modulation using silicon photonics.
- Challenges remain in hybrid silicon laser quality, conversion efficiency, device integration, and fabrication.
- The development of single-chip electronic-photonic-THz circuits is a key future direction.
Conclusions:
- Silicon photonics is crucial for the future of integrated THz systems.
- Overcoming fabrication and integration challenges is essential for realizing practical THz devices.
- The ultimate goal is the development of a single chip integrating electronics, photonics, and THz functionalities.
