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4H-SiC Double Trench MOSFET with Split Heterojunction Gate for Improving Switching Characteristics
Jaeyeop Na1, Jinhee Cheon1, Kwangsoo Kim1
1Department of Electronic Engineering, Sogang University, Seoul 04107, Korea.
Materials (Basel, Switzerland)
|July 2, 2021
Summary
A new 4H-SiC heterojunction gate transistor significantly enhances switching speed and reduces power loss. This novel device design improves reverse recovery charge and switching loss compared to existing technologies.
Area of Science:
- Materials Science
- Electrical Engineering
- Semiconductor Physics
Background:
- Conventional double trench MOSFETs face limitations in switching speed and power loss.
- Existing split gate designs offer partial improvements but retain certain drawbacks.
Purpose of the Study:
- To introduce a novel 4H-SiC split heterojunction gate double trench metal-oxide-semiconductor field-effect transistor (SHG-DTMOS).
- To enhance switching speed and reduce power loss in power electronic devices.
Main Methods:
- Modification of the N+ polysilicon split gate to a P+ polysilicon split gate in a double trench MOSFET structure.
- Incorporation of two separate P+ shielding regions under the gate.
- Utilizing the P+ split polysilicon gate as a heterojunction body diode to prevent reverse leakage current.
Main Results:
- The SHG-DTMOS exhibits static and dynamic characteristics comparable to the SG-DTMOS.
- Reverse recovery charge is improved by 65.83% (vs. Con-DTMOS) and 73.45% (vs. SG-DTMOS).
- Switching loss is reduced by 54.84% (vs. Con-DTMOS) and 44.98% (vs. SG-DTMOS) due to the heterojunction.
Conclusions:
- The novel SHG-DTMOS design effectively improves reverse recovery and reduces switching losses in 4H-SiC power devices.
- The heterojunction approach is key to achieving significant performance enhancements.
- This technology holds promise for more efficient power electronics applications.
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