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Monolithic optical microlithography of high-density elastic circuits.

Yu-Qing Zheng¹, Yuxin Liu², Donglai Zhong¹

¹Department of Chemical Engineering, Stanford University, Stanford, CA 94305, USA.

Science (New York, N.Y.)

|July 2, 2021

Summary

Researchers developed a new optical microlithography technique for creating high-density, stretchable electronic circuits. This method enables the fabrication of complex elastic circuits with performance comparable to rigid electronics.

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Area of Science:

Materials Science
Electronics Engineering
Nanotechnology

Background:

Polymeric electronic materials have advanced soft and stretchable electronics.
Current fabrication methods limit device density and parallel processing in elastic circuits compared to silicon-based devices.

Purpose of the Study:

To develop a universal micro/nanofabrication method for skin-like and elastic circuits.
To increase device density and parallel signal recording and processing capabilities.

Main Methods:

A monolithic optical microlithographic process was employed.
Sequential ultraviolet light-triggered solubility modulation was used to micropattern elastic electronic materials.

Main Results:

Transistors with 2-micrometer channel lengths were fabricated at a density of 42,000 per square centimeter.
Elastic circuits, including XOR gates and half adders, were successfully fabricated.
The process allows for wafer-level fabrication of complex, high-density, and multilayered elastic circuits.

Conclusions:

The developed optical microlithography process overcomes limitations in elastic circuit fabrication.
This technique paves the way for high-performance elastic circuits rivaling rigid counterparts.
Enables advanced applications in soft and stretchable electronics.