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Related Concept Videos

Biasing of Metal-Semiconductor Junctions01:27

Biasing of Metal-Semiconductor Junctions

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Biasing metal-semiconductor junctions involves applying a voltage across the junction. Specifically, the metal is connected to a voltage source, while the semiconductor is grounded. This technique is essential for controlling the direction and magnitude of current flow in electronic devices, including diodes, transistors, and photovoltaic cells.
In Schottky junctions, where the semiconductor is n-type, applying a positive voltage to the metal relative to the semiconductor reduces its Fermi...
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Metal-Semiconductor Junctions01:24

Metal-Semiconductor Junctions

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The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
Schottky Barriers
Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
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Semiconductors01:22

Semiconductors

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There is variation in the electrical conductivity of materials - metals, semiconductors, and insulators that are showcased with the help of the energy band diagrams.
Metals such as copper (Cu), zinc (Zn), or lead (Pb) have low resistivity and feature conduction bands that are either not fully occupied or overlap with the valence band, making a bandgap non-existent. This allows electrons in the highest energy levels of the valence band to easily transition to the conduction band upon gaining...
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Biasing of P-N Junction01:16

Biasing of P-N Junction

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The operation of a p-n junction diode involves various biasing conditions, including forward bias, reverse bias, and equilibrium.
In equilibrium, no external voltage is applied across the p-n junction. The depletion region is formed at the junction interface due to the diffusion of carriers, which leaves behind charged dopants, acceptors on the p-side, and donors on the n-side. These immobile charges create an electric field that prevents further diffusion of carriers. The related energy band...
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Carrier Generation and Recombination01:22

Carrier Generation and Recombination

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Carrier generation is the process by which electron-hole pairs (EHPs) are created within the semiconductor. In direct-bandgap semiconductors, such as gallium arsenide (GaAs), this occurs efficiently when energy absorption prompts valence electrons to leap into the conduction band, leaving behind holes.
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Indirect generation involves an...
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P-N junction01:11

P-N junction

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A p-n junction is formed when p-type and n-type semiconductor materials are joined together. At the interface of the p-n junction, holes from the p-side and electrons from the n-side begin to diffuse into the opposite sides due to the concentration gradient. This diffusion of carriers leads to a region around the junction where there are no free charge carriers, known as the depletion region. The charge density within the depletion region for the n-side and p-side can be described by the...
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Related Experiment Video

Updated: Oct 27, 2025

Probe Type II Band Alignment in One-Dimensional Van Der Waals Heterostructures Using First-Principles Calculations
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Band offset in semiconductor heterojunctions.

Giovanni Di Liberto1, Gianfranco Pacchioni1

  • 1Dipartimento di Scienza dei Materiali, Università di Milano-Bicocca, via R. Cozzi 55, 20125 Milano, Italy.

Journal of Physics. Condensed Matter : an Institute of Physics Journal
|July 20, 2021
PubMed
Summary
This summary is machine-generated.

Comparing simulation methods for semiconductor heterostructures, the alternating slabs junction (ASJ) and surface terminated junction (STJ) approaches accurately predict band offsets. The independent units (IU) method provides only qualitative estimates.

Keywords:
band alignmentband gapdensity functional theorysemiconductors

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Area of Science:

  • Materials Science
  • Computational Physics
  • Solid-State Chemistry

Background:

  • Semiconductor heterojunctions are vital for devices like lasers, solar cells, and transistors.
  • Their performance hinges on the alignment of band edges, crucial for applications like photocatalysis.
  • Accurate simulation of heterostructures is essential for predicting device behavior.

Purpose of the Study:

  • To compare the performance of three density functional theory (DFT) based methods for simulating semiconductor heterostructures.
  • To benchmark the accuracy of band offset predictions for ten different semiconductor heterojunctions against experimental data.
  • To evaluate the effectiveness of different common reference determination techniques.

Main Methods:

  • Utilized DFT calculations with hybrid functionals to simulate ten semiconductor heterostructures.
  • Employed three simulation approaches: alternating slabs junction (ASJ), surface terminated junction (STJ), and independent units (IU).
  • Determined common reference levels using plane-averaged electrostatic potential and core level energies.

Main Results:

  • The ASJ and STJ methods achieved high accuracy, estimating band offsets within approximately 0.2 eV of experimental values.
  • The IU method, which neglects interface effects, yielded only qualitative band offset estimates with significant deviations.
  • Both plane-averaged electrostatic potential and core level energies proved effective for common reference determination.

Conclusions:

  • The ASJ and STJ methods are recommended for accurate band offset calculations in semiconductor heterostructures.
  • The IU method is suitable for qualitative assessments but not for precise quantitative predictions.
  • Accurate band offset prediction is critical for optimizing heterojunction-based device performance.