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Laser Printing of Multilayered Alternately Conducting and Insulating Microstructures
Eitan Edri1,2, Nina Armon1,2, Ehud Greenberg1,2
1Department of Chemistry, Bar-Ilan University, Ramat Gan 5290002, Israel.
ACS Applied Materials & Interfaces
|July 23, 2021
Summary
This study introduces a novel laser printing technique for creating multilayered microelectronic components. The method successfully fabricates conducting platinum and insulating silicon oxide layers, paving the way for advanced microdevices.
Area of Science:
- Materials Science
- Nanotechnology
- Microfabrication
Background:
- Multilayered microstructures are crucial for microelectronic components.
- Existing fabrication methods (top-down, bottom-up) have limitations.
- Laser-based patterning offers high resolution but hasn't achieved multilayered conducting/insulating structures.
Purpose of the Study:
- To demonstrate a new laser printing method for fabricating multilayered microstructures.
- To create structures with alternating conducting (platinum) and insulating (silicon oxide) layers.
- To explore microfluidics for enhanced multilayered fabrication.
Main Methods:
- Utilized laser printing with thermally driven reactions and microbubble assistance.
- Employed platinum(II) chloride (PtCl2) in N-methyl-2-pyrrolidone (NMP) for platinum layers.
- Used tetraethyl orthosilicate in NMP for silicon oxide layers, confirmed by Raman spectroscopy.
Main Results:
- Successfully fabricated multilayered structures of conducting platinum and insulating silicon oxide.
- Achieved control over insulating layer height (50-250 nm) by adjusting laser power and iterations.
- Measured silicon oxide resistivity at 1.5 × 10^11 Ωm.
- Identified and discarded unsuitable porous/cracking insulating materials.
Conclusions:
- The developed laser printing technique enables the fabrication of multilayered microstructures with conducting and insulating properties.
- Microfluidic integration enhances the process by enabling rapid precursor switching.
- This approach offers a simplified pathway for producing advanced multilayered microelectronic devices.

