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A Bond-Wire Drift Offset Minimized Capacitance-to-Digital Interface for MEMS Accelerometer with Gain-Enhanced

Fanyang Li1, Tao Yin2,3, Haigang Yang3,4,5

  • 1Fujian Province Integrated Circuit Design Center, Fuzhou University, Fuzhou 350108, China.

Sensors (Basel, Switzerland)
|July 24, 2021
PubMed

Keywords:
MEMSVCOaccelerometerbond-wiredigital choppingoffset

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