Comparative analysis of ventilation efficiency on ultrafine particle removal in university MakerSpaces

The proliferation of 3D printing MakerSpaces in university settings has led to an increased risk of student and technician exposure to ultrafine particles. New MakerSpaces do not have standardized specifications to aid in the design of the space; therefore, a need exists to characterize the impacts of different engineering controls on MakerSpace air quality. This study compares three university MakerSpaces: a library MakerSpace operating ≤4 devices under typical office space ventilation with no engineering controls, a laboratory MakerSpace operating 29 printers inside grated cabinets, with laboratory-grade ventilation, and a center MakerSpace operating ≤4 devices with neither engineering controls nor internal ventilation. All MakerSpaces were studied under both controlled (using a standard print design) and uncontrolled (real-time user operation) conditions measuring emitted particle concentrations in the near-field. Additionally, volatile organic emissions and the difference between near-field and far-field particle concentrations were investigated in multiple MakerSpaces. The center MakerSpace had the greatest net increase in mean particle number concentration (+1378.9% relative to background during a print campaign using polylactic acid (PLA) filament in a MakerBot (MakerBot-PLA)). The number-weighted mean diameter had the greatest change relative to background during the library campaign, +37.1% for the Lulzbot-PLA and -56.1% for the Ultimaker-PLA studies. For the standard NIST design with MakerBot-PLA, the laboratory's particle removal ratio was 30 times greater than in the library with open cabinets and 54 times greater when the cabinet doors were closed. The average particle removal rate from the center MakerSpace was up to 2.5 times less efficient than that of the library for the same MakerBot-PLA combination. These results suggest ventilation as a key priority in the design of a new university MakerSpace.