Deep-Sintered Copper Tracks for Thermal Oxidation Resistance Using Large Pulsed Electron Beam
Yunjae Hwang1, Jisoo Kim2,3, Changyong Yim2,4
1School of Mechanical and Nuclear Engineering, Ulsan National Institute of Science and Technology (UNIST), UNIST-gil 50, Eonyang-eup, Ulju-gun, Ulsan 44919, Republic of Korea.
ACS Omega
|August 2, 2021
Summary
This study developed copper nanoparticle (CuNP) conductive tracks using large pulsed electron beam (LPEB) sintering. The resulting tracks show excellent thermal oxidation resistance and sustained electrical conductivity at high temperatures without additives.
Area of Science:
- Materials Science
- Nanotechnology
- Electrical Engineering
Background:
- Thermal oxidation resistance is crucial for printed electronics operating in high-temperature environments.
- Maintaining electrical conductivity under harsh conditions is a key challenge in electronic device longevity.
Purpose of the Study:
- To fabricate copper nanoparticle (CuNP)-based conductive tracks with enhanced thermal oxidation resistance.
- To investigate the effect of large pulsed electron beam (LPEB) irradiation on CuNP sintering and conductivity.
- To demonstrate the performance of these conductive tracks in a high-temperature application.
Main Methods:
- Copper nanoparticles (CuNPs) were sintered using large pulsed electron beam (LPEB) irradiation at varying acceleration voltages.
- Electrical conductivity and thermal oxidation resistance of the sintered Cu tracks were evaluated at high temperatures (up to 220 °C).
- Comparison with films sintered by lower voltage LPEB and intense pulsed light (IPL) irradiation was performed.
Main Results:
- LPEB irradiation at 11 kV induced deep sintering of CuNPs, resulting in bulk-like electrical conductivity.
- Sintered Cu tracks maintained high electrical conductivity at 220 °C without protective additives.
- Lower voltage LPEB and IPL treatments resulted in thin sintered layers, leading to rapid oxidation and conductivity loss at high temperatures.
Conclusions:
- LPEB sintering at 11 kV effectively creates highly thermal oxidation-resistant copper conductive tracks.
- This method offers a promising approach for durable printed electronics in demanding thermal environments.
- The improved performance was validated through the successful application in a Joule heater device.
