Electric pulse heating device for the analysis of solid/solid phase transformations

Ohmic pulse heating is applied to investigate diffusion and interface controlled solid-state phase transformations. The developed device uses extensive solid-state electronics providing a high current, low voltage approach that overcomes the limitations of existing setups, most notably the use of sample geometries that allow for the reliable measurement of local temperatures and their assignment to microstructures. Power for heating is supplied by a capacitor array with adjustable voltage, and the process is controlled by microcontrollers and a solid-state relay, which allows for controlled pulses that are adjustable in microseconds. Electric currents of up to 22 kA at 90 V can be realized by the setup. Electric data are monitored and collected during the experiments, and temperature data are captured using a high-resolution infrared camera at high frame rates (1200 fps). The capabilities of the setup are demonstrated by rapid heating (10⁶ K/s) and subsequent cooling of a brass sample. Two distinct areas of the sample are analyzed in detail, showing similar heating, but different cooling curves with rates of 10⁴ and 10² K/s. Local microstructure analysis shows that different phase transformation mechanisms were dominant, and thus, the setup fulfills its purpose.