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Standing Waves in a Cavity

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A household microwave and lasers are examples of standing electromagnetic waves in a cavity. When two conducting metal plates are placed parallel at the nodal planes, it creates a cavity where standing waves are formed. The cavity between the two planes is analogous to a stretched string held at the points x = 0 and x = L. Here, the distance 'L' between the two planes must be an integer multiple of half of the wavelength. The wavelengths that satisfy this condition are given by:

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Silicon Nanowires and Optical Stimulation for Investigations of Intra- and Intercellular Electrical Coupling

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Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements.

Yilin Xu^1,2, Pascal Maier^1,2, Matthias Blaicher^1,2

¹Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), Engesserstrasse 5, 76131, Karlsruhe, Germany.

Scientific Reports

|August 13, 2021

Summary

This summary is machine-generated.

This study introduces 3D-printed photonic wire bonds for hybrid external-cavity lasers (ECL). This novel approach enables low-loss coupling for chip-scale lasers, overcoming fabrication challenges in semiconductor optical amplifiers (SOA) and photonic integrated circuits (PIC).

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Area of Science:

Photonics
Semiconductor devices
Integrated optics

Background:

Chip-scale external-cavity lasers (ECL) integrate semiconductor optical amplifiers (SOA) with silicon photonic integrated circuits (PIC) for wideband tunability and narrow linewidths.
Current fabrication methods involve complex monolithic integration or high-precision, costly assembly for low-loss coupling between SOAs and feedback circuits.
These methods present significant technological and cost barriers to scalable ECL production.

Purpose of the Study:

To demonstrate a novel class of hybrid ECL overcoming fabrication limitations.
To utilize 3D-printed photonic wire bonds as intra-cavity coupling elements for improved integration.
To enable cost-effective, high-performance chip-scale laser manufacturing.

Main Methods:

Development of 3D-printed photonic wire bonds for in-situ, automated, and adaptive coupling.
Hybrid integration of a reflective SOA (RSOA) with a silicon photonic external feedback circuit.
Characterization of laser performance including tuning range, side mode suppression ratio, and intrinsic linewidth.

Main Results:

Achieved a single-mode tuning range from 1515 to 1565 nm.
Demonstrated side mode suppression ratios exceeding 40 dB.
Measured intrinsic linewidths as low as 105 kHz, showcasing high performance.

Conclusions:

3D-printed photonic wire bonds offer a scalable and flexible solution for hybrid ECL fabrication.
This approach combines the benefits of monolithic integration with the adaptability of multi-chip assemblies.
The technology paves the way for integrated ECLs on diverse photonic platforms.