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Fiber Surface/Interfacial Engineering on Wearable Electronics.

Ruimin Xiao1, Guiqin Yu2, Ben Bin Xu3

  • 1Department of Materials, Faculty of Science and Engineering, University of Manchester, Oxford Rd., Manchester, M13 9PL, UK.

Small (Weinheim an Der Bergstrasse, Germany)
|August 21, 2021
PubMed
Summary

Surface/interfacial engineering enhances fiber materials for new functionalities. A novel self-assembly method shows promise for modifying metal-oxide framework (MOF) fibers for wearable electronics.

Keywords:
covalent interactionfibersurface modificationwearable electronicsπ-π stacking

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Textile Engineering

Background:

  • Surface and interfacial engineering are crucial for tailoring fiber properties and enabling new applications.
  • Existing physical and chemical treatment methods offer diverse functionalities but can be harsh.
  • Metal-oxide framework (MOF) fibers represent a new class of materials with potential in electronics.

Purpose of the Study:

  • To review current surface/interfacial engineering techniques for fiber materials.
  • To introduce a novel, nondestructive surface modification approach: self-assembly via π-π stacking.
  • To explore the potential of MOF fibers for wearable electronic applications.

Main Methods:

  • Comprehensive literature review of physical and chemical surface treatment methods for fibers.
  • Introduction and theoretical exploration of self-assembly via π-π stacking for fiber surface modification.
  • Analysis of MOF fiber properties relevant to wearable electronics.

Main Results:

  • Current methods for fiber surface modification are diverse, with various real-world applications.
  • Self-assembly via π-π stacking offers a nondestructive and promising route for fiber surface engineering.
  • MOF fibers demonstrate significant potential for use in fiber-based wearable electronics.

Conclusions:

  • Advancing the understanding of surface/interfacial engineering is key for fiber materials.
  • The novel self-assembly technique provides a new avenue for nondestructive fiber modification.
  • This work is expected to guide the rational design of future fiber-based wearable electronics.