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Updated: Oct 22, 2025
Non-plasma Bonding of PDMS for Inexpensive Fabrication of Microfluidic Devices
Published on: November 1, 2007
PDMS Bonding Technologies for Microfluidic Applications: A Review
Alexandra Borók1, Kristóf Laboda1, Attila Bonyár1
1Department of Electronics Technology, Faculty of Electrical Engineering and Informatics, Budapest University of Technology and Economics, H-1111 Budapest, Hungary.
Abstract:
This review summarizes and compares the available surface treatment and bonding techniques (e.g., corona triggered surface activation, oxygen plasma surface activation, chemical gluing, and mixed techniques) and quality/bond-strength testing methods (e.g., pulling test, shear test, peel test, leakage test) for bonding PDMS (polydimethylsiloxane) with other materials, such as PDMS, glass, silicon, PET (polyethylene terephthalate), PI (polyimide), PMMA (poly(methyl methacrylate)), PVC (polyvinyl chloride), PC (polycarbonate), COC (cyclic olefin copolymer), PS (polystyrene) and PEN (polyethylene naphthalate). The optimized process parameters for the best achievable bond strengths are collected for each substrate, and the advantages and disadvantages of each method are discussed in detail.
