Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane

Adrian Schwenck1, Tobias Grözinger1, Thomas Günther1,2

  • 1Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, Germany.

Summary

This study optimized capacitive pressure sensors by comparing four joining methods: transient liquid phase (TLP) bonding, reactive joining, silver sintering, and electric resistance welding. TLP bonding and sintering offered the best accuracy, while welding and sintering showed excellent long-term stability.