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Published on: March 24, 2023
Characterization of a PCB Based Pressure Sensor and Its Joining Methods for the Metal Membrane
Adrian Schwenck1, Tobias Grözinger1, Thomas Günther1,2
1Hahn-Schickard, Allmandring 9b, 70569 Stuttgart, Germany.
This study optimized capacitive pressure sensors by comparing four joining methods: transient liquid phase (TLP) bonding, reactive joining, silver sintering, and electric resistance welding. TLP bonding and sintering offered the best accuracy, while welding and sintering showed excellent long-term stability.
Area of Science:
- Materials Science
- Sensor Technology
- Mechanical Engineering
Background:
- Essential quality features for pressure sensors include accuracy, measurement range, operating temperature, and long-term stability.
- Capacitive pressure sensors are widely used but require optimization for demanding applications.
- The joining process significantly impacts sensor performance and reliability.
Purpose of the Study:
- To optimize the quality features of a capacitive pressure sensor with a 10-bar measurement range.
- To evaluate and compare different joining methods for sensor assembly.
- To assess the impact of joining techniques on sensor accuracy, stability, and cost.
Main Methods:
- Fabrication of a capacitive pressure sensor with a metal membrane connected to a PCB and digital readout.
- Comparative analysis of four joining techniques: transient liquid phase (TLP) bonding, reactive joining, silver sintering, and electric resistance welding.
- Characterization using measurement of characteristic curves, long-term stability tests at maximum pressure, and scanning electron microscopy (SEM) with energy-dispersive X-ray spectroscopy (EDX) for joint quality assessment.
Main Results:
- Transient liquid phase (TLP) bonding and silver sintering demonstrated the smallest measurement errors.
- Electric resistance welding and silver sintering exhibited no statistically significant long-term drift.
- Reactive joining and silver sintering were found to be the most cost-effective in terms of equipment.
- Electric resistance welding presented favorable conditions for mass production due to low material costs and short process times.
Conclusions:
- The choice of joining method critically influences the performance and suitability of capacitive pressure sensors for specific applications.
- TLP bonding and sintering are recommended for applications prioritizing high accuracy.
- Welding and sintering are suitable for applications requiring high long-term stability.
- Electric resistance welding offers a cost-effective and efficient solution for mass production of pressure sensors.
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