Photonic Lift-off Process to Fabricate Ultrathin Flexible Solar Cells

A microsecond time-scale photonic lift-off (PLO) process was used to fabricate mechanically flexible photovoltaic devices (PVs) with a total thickness of less than 20 μm. PLO is a rapid, scalable photothermal technique for processing extremely thin, mechanically flexible electronic and optoelectronic devices. PLO is also compatible with large-area devices, roll-to-roll processing, and substrates with low temperature compatibility. As a proof of concept, PVs were fabricated using CuInSe₂ nanocrystal ink deposited at room temperature under ambient conditions on thin, plastic substrates heated to 100 °C. It was necessary to prevent cracking of the brittle top contact layer of indium tin oxide (ITO) during lift-off, either by using a layer of silver nanowires (AgNW) as the top contact or by infusing the ITO layer with AgNW. This approach could generally be used to improve the mechanical versatility of current collectors in a variety of ultrathin electronic and optoelectronic devices requiring a transparent conductive contact layer.