Deformation Behavior and Microstructural Evolution of T-Shape Upsetting Test in Ultrafine-Grained Pure Copper

Area of Science:

• Materials Science
• Mechanical Engineering
• Metallurgy

Background:

• Ultrafine-grained (UFG) materials offer superior mechanical properties due to their ultra-high strength.
• Understanding size effects is crucial for optimizing material performance.

Purpose of the Study:

• To investigate the deformation behavior and microstructural evolution of UFG pure copper.
• To analyze the impact of process parameters on T-shape upsetting of UFG copper.

Main Methods:

• T-shape upsetting test performed on ultrafine-grained pure copper.
• Analysis of experimental results to determine the influence of geometric parameters and surface roughness.

Main Results:

• Edge radius and V-groove angle significantly affect rib height and aspect ratio during T-shape upsetting.
• Surface roughness impacts forming load more in the second stage of upsetting.
• The dynamic recrystallization temperature for UFG pure copper was identified between 200 °C and 250 °C.

Conclusions:

• Geometric factors critically influence the T-shape upsetting process of UFG pure copper.
• Process control, including surface finish, is vital for predictable forming loads.
• The determined dynamic recrystallization temperature provides key insights for thermal processing of UFG copper.