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Application of a Coupling Agent to Improve the Dielectric Properties of Polymer-Based Nanocomposites
Published on: September 19, 2020
Tuning Surface States of Metal/Polymer Contacts Toward Highly Insulating Polymer-Based Dielectrics
Yifei Wang1, Shamima Nasreen1, Deepak Kamal2
1Electrical Insulation Research Center, Institute of Materials Science, University of Connecticut, 97 N Eagleville Road, Storrs, Connecticut 06269, United States.
Abstract:
Metal-polymer interface plays a crucial role in controlling the dielectric performance in all flexible electronics. Ideally, the formation of the Schottky barrier due to the large band offset of the electron affinity of the polymer over the work function of the electrode should sufficiently impede the charge injection. Arguably, however, such an injection barrier has hardly been indisputably verified in polymer-metal junctions due to the ever-existing surface states, which dramatically compromise the barrier thus leading to undesired high electrical conduction. Here, we demonstrate experimentally a clear negative correlation between the breakdown strength and the density of surface states in polymer dielectrics. The existence of surface states reduces the effective barrier height for charge injection, as further revealed by density functional theory calculations and photoinjection current measurements. Based on these findings, we present a surface engineering method to enhance the breakdown strength with the application of nanocoatings on polymer films to eliminate surface states. The density of surface states is reduced by 2 orders of magnitude when the polymer is coated with a layer of two-dimensional hexagonal boron nitride nanosheets, leading to about 100% enhancement of breakdown strength. This work reveals the critical role played by surface states on electrical breakdown and provides a versatile surface engineering strategy to curtail surface states, broadly applicable for all polymer dielectrics.
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